DocumentCode :
2877179
Title :
HIGH PERFORMANCE PIN ELECTRONICS EMPLOYING GaAs IC AND HYBRID CIRCUIT PACKAGING TECHNOLOGY
Author :
Baril, Barry ; Clayson, Dan ; McCracken, David ; Taylor, Stewart
fYear :
1991
fDate :
26-30 Oct 1991
Firstpage :
777
Keywords :
Bandwidth; Circuit testing; Driver circuits; Electronic equipment testing; Electronic packaging thermal management; Electronics packaging; Gallium arsenide; Hybrid integrated circuits; Integrated circuit packaging; System testing;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Test Conference, 1991, Proceedings., International
ISSN :
1089-3539
Print_ISBN :
0-8186-9156-5
Type :
conf
DOI :
10.1109/TEST.1991.519743
Filename :
519743
Link To Document :
https://search.ricest.ac.ir/dl/search/defaultta.aspx?DTC=49&DC=2877179
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