Title :
Failure isolation using FIB assist Photon Emission Microscopy analysis and microprobe analysis
Author :
Wen, Gaojie ; Liu, Binghai ; Wang, Winter ; Li, Jinglong ; Tian, Li ; Wang, Xuezhu
Author_Institution :
Freescale Semicond. (China) Ltd., Tianjin, China
Abstract :
OBIRCH/EMMI and microprobe analysis were widely used to isolate failed device. But routine failure isolation method may not find the leakage path on some special functional failure cases. Two cases were presented to show a useful failure isolation strategy-FIB assisted photon emission analysis and microprobe by performing simulation or removing the load effect.
Keywords :
failure analysis; focused ion beam technology; integrated circuit reliability; FIB assist photon emission microscopy analysis; OBIRCH-EMMI; focused ion beam; microprobe analysis; routine failure isolation method; Failure analysis; Integrated circuit modeling; Layout; Metals; Performance evaluation; Photonics; Semiconductor device measurement;
Conference_Titel :
Physical and Failure Analysis of Integrated Circuits (IPFA), 2011 18th IEEE International Symposium on the
Conference_Location :
Incheon
Print_ISBN :
978-1-4577-0159-7
Electronic_ISBN :
1946-1542
DOI :
10.1109/IPFA.2011.5992737
