Comparisons of mechanical reliabilities of Sn-3.0Ag-0.5Cu solder between ENIG and immersion Sn pad finishes

Author

Kim, Jae-Myeong ; Jeong, Myeong-Hyeok ; Kwon, Sang-Hyun ; Yoo, Sehoon ; Park, Young-Bae

Author_Institution

Sch. of Mater. Sci. & Eng., Andong Nat. Univ., Andong, South Korea

fYear

2011

fDate

4-7 July 2011

Firstpage

1

Lastpage

4

Abstract

The effects of electroless nickel immersion gold (ENIG) and immersion Sn pad finishes on the shear strength of Sn-3.0Ag-0.5Cu solder joints were investigated under the various loading speeds of 0.2~1,000 mm/s. shear strength increased with increasing shear speed, while ductility and toughness decreased, while immersion Sn finish showed lower shear strength rather than ENIG finish. Overall, ENIG finish showed ductile to brittle fracture mode transition with increasing shear speed while immersion Sn finish only showed increasing brittle fracture mode ratio. Therefore, strong interfacial adhesion of ENIG finish rather than immersion Sn finish seems to be related to stronger bonding strength and also higher toughness of ENIG finish.

Keywords

brittle fracture; copper alloys; ductility; electronics packaging; reliability; shear strength; silver alloys; solders; tin alloys; ENIG finish; Sn-Ag-Cu; bonding strength; brittle fracture mode transition; electroless nickel immersion gold effect; electronic package; immersion tin pad finishes; mechanical reliability; shear strength; solder joints; Copper; Lead; Loading; Soldering; Surface cracks; Surface finishing; Tin;

fLanguage

English

Publisher

ieee

Conference_Titel

Physical and Failure Analysis of Integrated Circuits (IPFA), 2011 18th IEEE International Symposium on the

Conference_Location

Incheon

ISSN

1946-1542

Print_ISBN

978-1-4577-0159-7

Electronic_ISBN

1946-1542

Type

conf

DOI

10.1109/IPFA.2011.5992741

Filename

5992741