Title :
Comparisons of mechanical reliabilities of Sn-3.0Ag-0.5Cu solder between ENIG and immersion Sn pad finishes
Author :
Kim, Jae-Myeong ; Jeong, Myeong-Hyeok ; Kwon, Sang-Hyun ; Yoo, Sehoon ; Park, Young-Bae
Author_Institution :
Sch. of Mater. Sci. & Eng., Andong Nat. Univ., Andong, South Korea
Abstract :
The effects of electroless nickel immersion gold (ENIG) and immersion Sn pad finishes on the shear strength of Sn-3.0Ag-0.5Cu solder joints were investigated under the various loading speeds of 0.2~1,000 mm/s. shear strength increased with increasing shear speed, while ductility and toughness decreased, while immersion Sn finish showed lower shear strength rather than ENIG finish. Overall, ENIG finish showed ductile to brittle fracture mode transition with increasing shear speed while immersion Sn finish only showed increasing brittle fracture mode ratio. Therefore, strong interfacial adhesion of ENIG finish rather than immersion Sn finish seems to be related to stronger bonding strength and also higher toughness of ENIG finish.
Keywords :
brittle fracture; copper alloys; ductility; electronics packaging; reliability; shear strength; silver alloys; solders; tin alloys; ENIG finish; Sn-Ag-Cu; bonding strength; brittle fracture mode transition; electroless nickel immersion gold effect; electronic package; immersion tin pad finishes; mechanical reliability; shear strength; solder joints; Copper; Lead; Loading; Soldering; Surface cracks; Surface finishing; Tin;
Conference_Titel :
Physical and Failure Analysis of Integrated Circuits (IPFA), 2011 18th IEEE International Symposium on the
Conference_Location :
Incheon
Print_ISBN :
978-1-4577-0159-7
Electronic_ISBN :
1946-1542
DOI :
10.1109/IPFA.2011.5992741
