DocumentCode
2877259
Title
Crosstalk Analysis between Interconnects in High-Speed Server Packages
Author
Choi, Jinwoo ; Krauter, Byron ; Haridass, Anand ; Weekly, Roger ; Douriet, Daniel ; Chun, Sungjun
Author_Institution
IBM Corp., Austin
fYear
2007
fDate
May 29 2007-June 1 2007
Firstpage
333
Lastpage
338
Abstract
This paper discusses crosstalk analysis between interconnects in high-speed server packages. Over the last decade, the scaling of the CMOS transistors has enabled the design of microprocessors operating at multi-gigahertz frequencies. For meeting the high bandwidth demands and low-power requirements, digital technologies are quickly moving to gigabit data rate and sub-voltage range signaling levels. However, this higher speed performance comes at a price, which means that signal integrity becomes a significant portion of the design effort. Especially, crosstalk analysis between interconnects in high-speed packages has become critical for design optimization of signal interconnects in system. This paper investigates importance of crosstalk analysis for IBM´s high-speed server packages. For an efficient crosstalk analysis between interconnects in highspeed digital systems, an IBM´s internal tool called PATS (package analysis tool suite) was used to investigate crosstalk over 1000 signal nets. The ISNRR (integral of squared noise ramp response) method has been developed to quantify crosstalk accurately and used to analyze IBM´s organic modules for high-speed applications.
Keywords
CMOS integrated circuits; crosstalk; integrated circuit interconnections; integrated circuit packaging; microprocessor chips; transistors; CMOS transistors; crosstalk analysis; gigabit data rate; high-speed server packages; microprocessors; signal interconnects; subvoltage range signaling; Bandwidth; CMOS technology; Crosstalk; Design optimization; Digital systems; Frequency; Microprocessors; Packaging; Signal analysis; Signal design;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronic Components and Technology Conference, 2007. ECTC '07. Proceedings. 57th
Conference_Location
Reno, NV
ISSN
0569-5503
Print_ISBN
1-4244-0985-3
Electronic_ISBN
0569-5503
Type
conf
DOI
10.1109/ECTC.2007.373819
Filename
4249905
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