• DocumentCode
    2877259
  • Title

    Crosstalk Analysis between Interconnects in High-Speed Server Packages

  • Author

    Choi, Jinwoo ; Krauter, Byron ; Haridass, Anand ; Weekly, Roger ; Douriet, Daniel ; Chun, Sungjun

  • Author_Institution
    IBM Corp., Austin
  • fYear
    2007
  • fDate
    May 29 2007-June 1 2007
  • Firstpage
    333
  • Lastpage
    338
  • Abstract
    This paper discusses crosstalk analysis between interconnects in high-speed server packages. Over the last decade, the scaling of the CMOS transistors has enabled the design of microprocessors operating at multi-gigahertz frequencies. For meeting the high bandwidth demands and low-power requirements, digital technologies are quickly moving to gigabit data rate and sub-voltage range signaling levels. However, this higher speed performance comes at a price, which means that signal integrity becomes a significant portion of the design effort. Especially, crosstalk analysis between interconnects in high-speed packages has become critical for design optimization of signal interconnects in system. This paper investigates importance of crosstalk analysis for IBM´s high-speed server packages. For an efficient crosstalk analysis between interconnects in highspeed digital systems, an IBM´s internal tool called PATS (package analysis tool suite) was used to investigate crosstalk over 1000 signal nets. The ISNRR (integral of squared noise ramp response) method has been developed to quantify crosstalk accurately and used to analyze IBM´s organic modules for high-speed applications.
  • Keywords
    CMOS integrated circuits; crosstalk; integrated circuit interconnections; integrated circuit packaging; microprocessor chips; transistors; CMOS transistors; crosstalk analysis; gigabit data rate; high-speed server packages; microprocessors; signal interconnects; subvoltage range signaling; Bandwidth; CMOS technology; Crosstalk; Design optimization; Digital systems; Frequency; Microprocessors; Packaging; Signal analysis; Signal design;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronic Components and Technology Conference, 2007. ECTC '07. Proceedings. 57th
  • Conference_Location
    Reno, NV
  • ISSN
    0569-5503
  • Print_ISBN
    1-4244-0985-3
  • Electronic_ISBN
    0569-5503
  • Type

    conf

  • DOI
    10.1109/ECTC.2007.373819
  • Filename
    4249905