DocumentCode :
2877259
Title :
Crosstalk Analysis between Interconnects in High-Speed Server Packages
Author :
Choi, Jinwoo ; Krauter, Byron ; Haridass, Anand ; Weekly, Roger ; Douriet, Daniel ; Chun, Sungjun
Author_Institution :
IBM Corp., Austin
fYear :
2007
fDate :
May 29 2007-June 1 2007
Firstpage :
333
Lastpage :
338
Abstract :
This paper discusses crosstalk analysis between interconnects in high-speed server packages. Over the last decade, the scaling of the CMOS transistors has enabled the design of microprocessors operating at multi-gigahertz frequencies. For meeting the high bandwidth demands and low-power requirements, digital technologies are quickly moving to gigabit data rate and sub-voltage range signaling levels. However, this higher speed performance comes at a price, which means that signal integrity becomes a significant portion of the design effort. Especially, crosstalk analysis between interconnects in high-speed packages has become critical for design optimization of signal interconnects in system. This paper investigates importance of crosstalk analysis for IBM´s high-speed server packages. For an efficient crosstalk analysis between interconnects in highspeed digital systems, an IBM´s internal tool called PATS (package analysis tool suite) was used to investigate crosstalk over 1000 signal nets. The ISNRR (integral of squared noise ramp response) method has been developed to quantify crosstalk accurately and used to analyze IBM´s organic modules for high-speed applications.
Keywords :
CMOS integrated circuits; crosstalk; integrated circuit interconnections; integrated circuit packaging; microprocessor chips; transistors; CMOS transistors; crosstalk analysis; gigabit data rate; high-speed server packages; microprocessors; signal interconnects; subvoltage range signaling; Bandwidth; CMOS technology; Crosstalk; Design optimization; Digital systems; Frequency; Microprocessors; Packaging; Signal analysis; Signal design;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electronic Components and Technology Conference, 2007. ECTC '07. Proceedings. 57th
Conference_Location :
Reno, NV
ISSN :
0569-5503
Print_ISBN :
1-4244-0985-3
Electronic_ISBN :
0569-5503
Type :
conf
DOI :
10.1109/ECTC.2007.373819
Filename :
4249905
Link To Document :
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