Modelling the reliability of green electronic interconnects

Author

Bailey, C. ; Lu, H. ; Yin, C. ; Stoyanov, S.

Author_Institution

Sch. of Comput. & Math. Sci., Univ. of Greenwich, London, UK

fYear

2004

fDate

2004

Firstpage

63

Lastpage

67

Abstract

The adoption of lead-free interconnection materials and other environmentally friendly materials is causing a number of concerns for electronic package manufacturers. In this paper the methodology and results of using computer modelling to study the reliability of flip chips with lead-free solder, anisotropic conductive adhesive films and isotropic adhesives interconnects are discussed. It is shown that with currently available material data and computer modelling techniques many useful trends in reliability can be predicted and the results can be used to improve the initial product design and speed up the material section process.

Keywords

adhesives; circuit reliability; electronic engineering computing; electronics packaging; environmental factors; flip-chip devices; interconnections; modelling; solders; PHYSICA software package; anisotropic conductive adhesive films; coefficient of thermal expansion; computer modelling; electronic package manufacturers; environmentally friendly materials; flip chips; geometric parameters; green electronic interconnects; isotropic adhesives; lead-free interconnection materials; lead-free solder; reliability modelling; Anisotropic conductive films; Anisotropic magnetoresistance; Conducting materials; Conductive adhesives; Electronics packaging; Environmentally friendly manufacturing techniques; Flip chip; Lead; Materials reliability; Predictive models;

fLanguage

English

Publisher

ieee

Conference_Titel

Asian Green Electronics, 2004. AGEC. Proceedings of 2004 International IEEE Conference on the

Print_ISBN

0-7803-8203-X

Type

conf

DOI

10.1109/AGEC.2004.1290868

Filename

1290868