Title :
Novel epoxy/BaTiO3 composite embedded capacitor films embedded in organic substrates
Author :
Paik, Kyung-Wook ; Cho, Sungdong ; Hyun, Jni-Gul
Author_Institution :
Dept. of Mater. Sci. & Eng., Korea Adv. Inst. of Sci. & Technol., Daejeon, South Korea
Abstract :
Embedded passive technology is an essential technology for further miniaturization and higher performance of electronic package systems. Polymer/ceramic composites have been of great interest as embedded capacitor materials, because they did combine not only the processability of polymers with high dielectric constant of ceramics but also good compatibility with printed circuit boards (PCBs). Novel embedded capacitor films (ECFs) were newly designed for low tolerance embedded capacitor fabrication for organic substrates. In terms of material formulation, ECFs are composed of specially formulated epoxy resin and latent curing agent. And in terms of coating process, a comma roll coating method is used for uniform film thickness in large area. In this paper, it is demonstrated that low tolerance (less than 5%) capacitor can be fabricated using ECFs, and properties of epoxy/BaTiO3 composite ECFs are reported. Fabrication process and various properties of ECFs such as dielectric constant, leakage current, adhesion strength, thereto-mechanical characteristics, reliability, and high frequency behavior up to 3 GHz will be presented.
Keywords :
MIM devices; S-parameters; adhesion; barium compounds; ceramic capacitors; curing; filled polymers; leakage currents; particle size; permittivity; scanning electron microscopy; thin film capacitors; 3 GHz; PCB compatibility; S-parameter; adhesion strength; composite embedded capacitor films; dielectric constant; electronic package systems; embedded decoupling capacitors; embedded passive technology; epoxy-BaTiO3 composite; high frequency behavior ceramic particles; latent curing agent; leakage current; low tolerance capacitor fabrication; metal-insulator-metal capacitors; polymer-ceramic composites; roll coating method; Capacitors; Ceramics; Coatings; Composite materials; Dielectric materials; Electronics packaging; Fabrication; High-K gate dielectrics; Polymers; Printed circuits;
Conference_Titel :
Asian Green Electronics, 2004. AGEC. Proceedings of 2004 International IEEE Conference on the
Print_ISBN :
0-7803-8203-X
DOI :
10.1109/AGEC.2004.1290869