Design of High-Density Interconnects for High-Speed Transmission

In this paper, we discuss about low-loss and crosstalk-robust line structure on the build-up printed-circuit boards. The equivalent attenuation is proposed as an evaluating figure of the line characteristics using attenuation and crosstalk coefficient. The characteristics of co-planar and diagonal-pair lines are compared by using the proposed equivalent attenuation. We demonstrate the diagonal-pair line is low-loss and crosstalk-robust structure as compared with the co-planar line on high-density build-up boards.