Title :
Numerical analysis and experimental verification of ISC(Integrated Smart Card) during bending and twist test
Author :
Bang, Jae-Oh ; Lee, Hyo-Soo ; An, Kyong-Jun ; Jung, Seung-Boo
Author_Institution :
Adv. Mater. Div., Korea Inst. of Ind. Technol., Incheon, South Korea
Abstract :
Recently, Advancements in information technology increasingly compact, lightweight, easy to pursuing the needs of users as (Needs) to meet the complex application of various types of products have been released. In this study, Numerical analysis of stress distribution and to optimize the location of the inserted device use to consisting of PVC material on the card and load displacement. In addition, through the bending test to evaluate the reliability of the specimen was carried out the validation of numerical analysis.
Keywords :
bending; flexible electronics; integrated circuit reliability; numerical analysis; smart cards; bending test; inserted device location; integrated smart card; numerical analysis; reliability; stress distribution; twist test; Materials; Numerical analysis; Radio frequency; Regression analysis; Smart cards; Strain; Stress;
Conference_Titel :
Physical and Failure Analysis of Integrated Circuits (IPFA), 2011 18th IEEE International Symposium on the
Conference_Location :
Incheon
Print_ISBN :
978-1-4577-0159-7
Electronic_ISBN :
1946-1542
DOI :
10.1109/IPFA.2011.5992759
