Numerical analysis and experimental verification of ISC(Integrated Smart Card) during bending and twist test

Author

Bang, Jae-Oh ; Lee, Hyo-Soo ; An, Kyong-Jun ; Jung, Seung-Boo

Author_Institution

Adv. Mater. Div., Korea Inst. of Ind. Technol., Incheon, South Korea

fYear

2011

fDate

4-7 July 2011

Firstpage

1

Lastpage

4

Abstract

Recently, Advancements in information technology increasingly compact, lightweight, easy to pursuing the needs of users as (Needs) to meet the complex application of various types of products have been released. In this study, Numerical analysis of stress distribution and to optimize the location of the inserted device use to consisting of PVC material on the card and load displacement. In addition, through the bending test to evaluate the reliability of the specimen was carried out the validation of numerical analysis.

Keywords

bending; flexible electronics; integrated circuit reliability; numerical analysis; smart cards; bending test; inserted device location; integrated smart card; numerical analysis; reliability; stress distribution; twist test; Materials; Numerical analysis; Radio frequency; Regression analysis; Smart cards; Strain; Stress;

fLanguage

English

Publisher

ieee

Conference_Titel

Physical and Failure Analysis of Integrated Circuits (IPFA), 2011 18th IEEE International Symposium on the

Conference_Location

Incheon

ISSN

1946-1542

Print_ISBN

978-1-4577-0159-7

Electronic_ISBN

1946-1542

Type

conf

DOI

10.1109/IPFA.2011.5992759

Filename

5992759