Title :
Lead free solder paste containing SnAgBiIn alloy: a preliminary study
Author :
Liu, Y. ; Wang, X.B.
Author_Institution :
Kester, Litton Components Pte Ltd, Singapore, Singapore
Abstract :
In this report, a preliminary investigation has been conducted on some lead free solder pastes containing Sn88Ag3.5Bi0.5In8 alloy. The wetting performances of these solder pastes on different substrates were studied under various reflow profiles. The test results of solder ball, slump and printing properties indicate that with a proper paste flux vehicle, lead free solder paste using Sn88Ag3.5Bi0.5In8 alloy may achieve a good performance.
Keywords :
adhesion; bismuth alloys; environmental factors; indium alloys; printed circuit manufacture; reflow soldering; shear strength; silver alloys; solders; tin alloys; viscosity; wetting; SnAgBiIn; electronic industry; lead free solder paste; printing properties; slump properties; solder ball; solderability; tackiness; various reflow profiles; viscosity; wetting performances; Copper alloys; Electronic components; Environmentally friendly manufacturing techniques; Humans; Lead; Performance evaluation; Printing; Temperature; Testing; Vehicles;
Conference_Titel :
Asian Green Electronics, 2004. AGEC. Proceedings of 2004 International IEEE Conference on the
Print_ISBN :
0-7803-8203-X
DOI :
10.1109/AGEC.2004.1290884
