Title :
Contact resistance and fretting corrosion of lead-free alloy coated electrical contacts
Author :
Wu, Ji ; Pecht, Michael G.
Author_Institution :
CALCE Electron. Products & Syst. Center, Maryland Univ., College Park, MD, USA
Abstract :
As lead-free solders replace tin-lead solders in soldering, it is also expected that lead-free solder alloys will be used as contact finish materials for electrical contacts. In this study, the contact resistance and fretting corrosion of tin-silver-copper and tin-copper coatings were investigated and compared with tin-lead eutectic coating. The contact resistance before after different aging conditions, including mixed flowing gas, steam, and dry heat aging, was examined. Tin-silver-copper and tin-lead alloy coatings have similar performance on contact resistance versus contact normal force after dry heat aging and MFG aging. Severe degradation was found on tin-silver-copper coatings after steam aging. Higher contact force is suggested in the application of tin-silver-copper solder alloy coating than for eutectic tin-lead alloy coatings. Fretting corrosion on tin-silver-copper and tin-copper lead-free alloy coatings was studied and compared with tin-lead coating. Fretting corrosion experiments were conducted and compared at different temperatures and normal forces. In general, tin-silver-copper and tin-copper alloys show equal or better fretting corrosion resistance than tin-lead eutectic alloy at the experimental conditions in this study.
Keywords :
ageing; contact resistance; copper alloys; corrosion; electrical contacts; silver alloys; solders; surface finishing; tin alloys; wear; SnAgCu; SnCu; aging conditions; contact finish materials; contact resistance; degradation; dry heat aging; electrical contacts; fretting corrosion; lead-free solders; mixed flowing gas aging; steam aging; Aging; Coatings; Contact resistance; Corrosion; Degradation; Environmentally friendly manufacturing techniques; Lead; Resistance heating; Soldering; Temperature;
Conference_Titel :
Asian Green Electronics, 2004. AGEC. Proceedings of 2004 International IEEE Conference on the
Print_ISBN :
0-7803-8203-X
DOI :
10.1109/AGEC.2004.1290885