• DocumentCode
    2877636
  • Title

    Environmental management in semiconductor and printed circuit board industry in India - part II: benchmarking and international best practice sharing

  • Author

    Schischke, Karsten ; Pandey, U.C. ; Sethi, V.C. ; Griese, Hansjoerg ; Reichl, Herbert

  • Author_Institution
    Technische Univ. Berlin, Germany
  • fYear
    2004
  • fDate
    2004
  • Firstpage
    150
  • Lastpage
    157
  • Abstract
    Part II of the paper on "environmental management in semiconductor and printed circuit board industry in India" sets the focus on benchmarking of the survey results and international best practice sharing. Environmental issues have got different priorities in different regions of the world. Also the general framework for the economy, open-mindedness for an appropriate environmental management and the approaches necessary to tackle environmental problems are specific for different regions. The part II paper compares the different background of Europe and India for implementing environmental management. The intermediary results of the DIT project are set in a global context through a benchmark analysis based on research and development activities of Fraunhofer IZM with European electronics industry. The importance of international know-how exchange to learn from each others\´ technological and environmental expertise is shown.
  • Keywords
    electron device manufacture; environmental management; international collaboration; printed circuits; India; PCB industry; benchmarking; environmental management; international best practice sharing; international know-how exchange; semiconductor industry; Best practices; Consumer electronics; Effluents; Electronics industry; Environmental management; Industrial electronics; Manufacturing industries; Printed circuits; Production; Recycling;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Asian Green Electronics, 2004. AGEC. Proceedings of 2004 International IEEE Conference on the
  • Print_ISBN
    0-7803-8203-X
  • Type

    conf

  • DOI
    10.1109/AGEC.2004.1290890
  • Filename
    1290890