DocumentCode
2877716
Title
A 90ns 256K × 1b DRAM with double level A1 technology
Author
Fujii, Teruya ; Mitake, K. ; Tada, Kazuki ; Inoue, Yasuyuki ; Watanabe, Hiromi ; Kudo, O. ; Yamamoto, Hiroshi
Author_Institution
Nippon Electric Co., Ltd., Kanagawa, Japan
Volume
XXVI
fYear
1983
fDate
23-25 Feb. 1983
Firstpage
226
Lastpage
227
Abstract
A 256K DRAM with 90
access time using double level aluminum technology will be reported. Employed are 1.3μ design rules and 160Å effective oxide thickness in a cell area of 66.5μ2. Chip area is 34mm2.
access time using double level aluminum technology will be reported. Employed are 1.3μ design rules and 160Å effective oxide thickness in a cell area of 66.5μ2. Chip area is 34mm2.Keywords
Assembly; Electronics packaging; Error analysis; Mass production; Paper technology; Plastics; Random access memory; Read-write memory; Redundancy; Temperature;
fLanguage
English
Publisher
ieee
Conference_Titel
Solid-State Circuits Conference. Digest of Technical Papers. 1983 IEEE International
Conference_Location
New York, NY, USA
Type
conf
DOI
10.1109/ISSCC.1983.1156541
Filename
1156541
Link To Document