Title :
Novel methodology for predictive interface reliability analysis in IC packages by a dual experimental and numerical approach
Author :
Hertl, M. ; Weidmann, D. ; Chauffleur, X. ; Dubois, G.
Author_Institution :
INSIDIX, Grenoble/Seyssins, France
Abstract :
Works on predictive reliability of IC packages are mostly dedicated to the failure of solder joints as structural material. The failure of interfaces, as links between two different materials, is often neglected in the process. This paper presents a new methodology, combining experimental and numerical work, to close this gap.
Keywords :
integrated circuit packaging; integrated circuit reliability; numerical analysis; solders; IC packages; interface reliability analysis; numerical analysis; solder joint failure; structural material; Delamination; Production; Stress; Surface topography; Temperature measurement; Time division multiplexing;
Conference_Titel :
Physical and Failure Analysis of Integrated Circuits (IPFA), 2011 18th IEEE International Symposium on the
Conference_Location :
Incheon
Print_ISBN :
978-1-4577-0159-7
Electronic_ISBN :
1946-1542
DOI :
10.1109/IPFA.2011.5992773
