DocumentCode
2877865
Title
Conduction mechanisms and reliability characteristics in MgO resistive switching memory devices
Author
Chiu, Fu-Chien ; Feng, Jun-Jea ; Shih, Wen-Chieh ; Cheng, Po-Yueh ; Huang, Chih-Yao
Author_Institution
Dept. of Electron. Eng., Ming-Chuan Univ., Guishan, Taiwan
fYear
2011
fDate
4-7 July 2011
Firstpage
1
Lastpage
4
Abstract
In this work, the resistive switching memory devices based on MgO thin film were fabricated and investigated. A forming electric field of about 2.36 MV/cm is required to induce bipolar resistive switching characteristic of the Pt/MgO/Pt metal-insulator-metal (MIM) diodes. At room temperature, the set and reset electric fields are about 1.5 MV/cm and -0.9 MV/cm, respectively. After the electroforming process, the resistance ratio of high resistance state (HRS) and low resistance state (LRS) is on the order of 105. The temperature dependence of current density-electric field (J-E) characteristics indicates that the dominant conduction mechanism is the hopping conduction and the Ohmic conduction in HRS and LRS, respectively. Accordingly, the hopping distance, trap energy level, and electron mobility in MgO films are obtained. In addition, the reliability characteristics of program/erase cycling endurance, data retention, and read durability of the MgO-based MIM memory devices were measured.
Keywords
MIM devices; magnesium compounds; random-access storage; semiconductor device reliability; MgO; bipolar resistive switching characteristic; conduction mechanisms; current density-electric field characteristics; dominant conduction mechanism; electroforming process; electron mobility; high resistance state; hopping conduction; hopping distance; low resistance state; metal-insulator-metal diodes; ohmic conduction; reliability characteristics; resistive switching memory devices; temperature dependence; thin film; trap energy level; Electric fields; Electron mobility; Electron traps; Energy states; Resistance; Switches; Temperature measurement;
fLanguage
English
Publisher
ieee
Conference_Titel
Physical and Failure Analysis of Integrated Circuits (IPFA), 2011 18th IEEE International Symposium on the
Conference_Location
Incheon
ISSN
1946-1542
Print_ISBN
978-1-4577-0159-7
Electronic_ISBN
1946-1542
Type
conf
DOI
10.1109/IPFA.2011.5992775
Filename
5992775
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