• DocumentCode
    2877865
  • Title

    Conduction mechanisms and reliability characteristics in MgO resistive switching memory devices

  • Author

    Chiu, Fu-Chien ; Feng, Jun-Jea ; Shih, Wen-Chieh ; Cheng, Po-Yueh ; Huang, Chih-Yao

  • Author_Institution
    Dept. of Electron. Eng., Ming-Chuan Univ., Guishan, Taiwan
  • fYear
    2011
  • fDate
    4-7 July 2011
  • Firstpage
    1
  • Lastpage
    4
  • Abstract
    In this work, the resistive switching memory devices based on MgO thin film were fabricated and investigated. A forming electric field of about 2.36 MV/cm is required to induce bipolar resistive switching characteristic of the Pt/MgO/Pt metal-insulator-metal (MIM) diodes. At room temperature, the set and reset electric fields are about 1.5 MV/cm and -0.9 MV/cm, respectively. After the electroforming process, the resistance ratio of high resistance state (HRS) and low resistance state (LRS) is on the order of 105. The temperature dependence of current density-electric field (J-E) characteristics indicates that the dominant conduction mechanism is the hopping conduction and the Ohmic conduction in HRS and LRS, respectively. Accordingly, the hopping distance, trap energy level, and electron mobility in MgO films are obtained. In addition, the reliability characteristics of program/erase cycling endurance, data retention, and read durability of the MgO-based MIM memory devices were measured.
  • Keywords
    MIM devices; magnesium compounds; random-access storage; semiconductor device reliability; MgO; bipolar resistive switching characteristic; conduction mechanisms; current density-electric field characteristics; dominant conduction mechanism; electroforming process; electron mobility; high resistance state; hopping conduction; hopping distance; low resistance state; metal-insulator-metal diodes; ohmic conduction; reliability characteristics; resistive switching memory devices; temperature dependence; thin film; trap energy level; Electric fields; Electron mobility; Electron traps; Energy states; Resistance; Switches; Temperature measurement;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Physical and Failure Analysis of Integrated Circuits (IPFA), 2011 18th IEEE International Symposium on the
  • Conference_Location
    Incheon
  • ISSN
    1946-1542
  • Print_ISBN
    978-1-4577-0159-7
  • Electronic_ISBN
    1946-1542
  • Type

    conf

  • DOI
    10.1109/IPFA.2011.5992775
  • Filename
    5992775