Title :
Advanced scanning acoustic technique application in flip-chip devices
Author :
Hu, X.H. ; Tay, M.Y. ; Tan, M.C. ; Zhao, X.L. ; Chin, J.M. ; Lei, H.
Author_Institution :
Device Anal. Lab., Adv. Micro Devices (Singapore) Pte Ltd., Singapore, Singapore
Abstract :
Micron-size embedded defects are challenging to detect using the traditional acoustic scanning microscope. This paper presents the latest acoustic techniques using Virtual Rescanning Mode™ (VRM) from Sonoscan® to successfully capture the defects localized at inter-layer dielectrics (ILD). Defects between copper trace and solder mask are more clearly seen when the magnitude of acoustic waveform changes from time domain to frequency domain.
Keywords :
acoustic imaging; copper alloys; flip-chip devices; solders; acoustic waveform; copper trace; flip-chip devices; frequency domain; interlayer dielectrics; micronsize embedded defects; scanning acoustic technique; solder mask; time domain; virtual rescanning mode; Acoustics; Copper; Delamination; Frequency domain analysis; Substrates; Time domain analysis; Transducers;
Conference_Titel :
Physical and Failure Analysis of Integrated Circuits (IPFA), 2011 18th IEEE International Symposium on the
Conference_Location :
Incheon
Print_ISBN :
978-1-4577-0159-7
Electronic_ISBN :
1946-1542
DOI :
10.1109/IPFA.2011.5992791
