Title :
Effect of Ni Addition on Bending Properties of Sn-Ag-Cu Lead-Free Solder Joints
Author :
Kobayashi, Takayuki ; Kariya, Yoshiharu ; Sasaki, Tsutomu ; Tanaka, Mitsuru ; Tatsumi, Kohei
Author_Institution :
Nippon Steel Corp., Futtsu
fDate :
May 29 2007-June 1 2007
Abstract :
Effect of Ni addition on the bending properties of Sn-Ag-Cu lead-free solder joints was investigated. Three point bending tests were conducted with a 324pin flip chip specimen at 10 Hz frequency and with 3mm substrate displacement. The test temperatures were 298 K and 398 K. At each temperature, Sn-l.2Ag-0.5Cu with a small amount of Ni addition, LF35 showed higher performance. The reason LF35 showed higher bending performance was discussed based on a mechanical fatigue test using a micro bulk specimen. Ni addition caused a fine subgrain of j3 -Sn, hence the crack propagation mechanism is changed, resulting in the improved fatigue performance of LF35.
Keywords :
bending; copper alloys; fatigue testing; flip-chip devices; nickel; silver alloys; solders; tin alloys; SnAgCu; bending properties; crack propagation mechanism; flip chip specimen; frequency 10 Hz; lead-free solder joints; mechanical fatigue test; microbulk specimen; substrate displacement; Environmentally friendly manufacturing techniques; Fatigue; Flip chip; Frequency; Lead; Materials science and technology; Mechanical factors; Soldering; Temperature; Testing;
Conference_Titel :
Electronic Components and Technology Conference, 2007. ECTC '07. Proceedings. 57th
Conference_Location :
Reno, NV
Print_ISBN :
1-4244-0985-3
Electronic_ISBN :
0569-5503
DOI :
10.1109/ECTC.2007.373870
