DocumentCode
2878220
Title
Dynamic Crack Propagation Prediction of Solder Joints under Impact Conditions
Author
Towashiraporn, Pongpinit ; Crosbie, Paul ; Brown, Matt ; Cavallaro, Alberto
Author_Institution
Motorola Inc., Libertyville
fYear
2007
fDate
May 29 2007-June 1 2007
Firstpage
689
Lastpage
694
Abstract
Failure predictive modeling based on cohesive constitutive relation is used to study the effect of solder-joint array geometry on the integrity of live solder joints. The dynamic overstress state and crack propagation of the interface between the solder and the pad results in complete interface separation. This failure mode is predominant under impact conditions and is captured accurately by a numerical model. Package-level drop tests were simulated and experimentally validated by a 4-point dynamic bend system.
Keywords
crack detection; failure (mechanical); impact (mechanical); solders; dynamic crack propagation; failure predictive modeling; impact conditions; solder-joint array geometry; Aluminum alloys; Assembly; Capacitive sensors; Creep; Integrated circuit interconnections; Materials reliability; Packaging; Soldering; Stress; Temperature;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronic Components and Technology Conference, 2007. ECTC '07. Proceedings. 57th
Conference_Location
Reno, NV
ISSN
0569-5503
Print_ISBN
1-4244-0985-3
Electronic_ISBN
0569-5503
Type
conf
DOI
10.1109/ECTC.2007.373871
Filename
4249957
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