DocumentCode :
2878539
Title :
Effect of Power and Ground Co-Reference to Performance of Memory Interface I/Os in FPGA and Structural ASIC Device Packages
Author :
Shi, Hong ; Jiang, Xiaohong ; Yew, Yeehuan
Author_Institution :
Altera Corp., San Jose
fYear :
2007
fDate :
May 29 2007-June 1 2007
Firstpage :
804
Lastpage :
809
Abstract :
In this paper, we present a summary of FPGA package development with focus on PDN and I/O co-design for optimal performance. Extensive simulation and characterization study are performed to address the effect of power and ground co-reference to memory interface I/O performance in large scale FPGA and structural ASIC devices.
Keywords :
application specific integrated circuits; field programmable gate arrays; FPGA; I/O co-design; PDN; memory interface; power and ground co-reference; structural ASIC device packages; Analytical models; Application specific integrated circuits; Crosstalk; Field programmable gate arrays; Packaging; Power distribution; Power system modeling; Power transmission lines; Silicon; Stripline;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electronic Components and Technology Conference, 2007. ECTC '07. Proceedings. 57th
Conference_Location :
Reno, NV
ISSN :
0569-5503
Print_ISBN :
1-4244-0985-3
Electronic_ISBN :
0569-5503
Type :
conf
DOI :
10.1109/ECTC.2007.373890
Filename :
4249976
Link To Document :
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