DocumentCode :
2878813
Title :
Finite Element Analysis Of The Electromagnetic Radiation From A VLSI Package Heatsink
Author :
Ladd, Darcy N. ; Costache, George I.
Author_Institution :
University of Ottawa Ottawa, Ontario
fYear :
1992
fDate :
17-21 Aug. 1992
Firstpage :
120
Lastpage :
123
Keywords :
Electromagnetic analysis; Electromagnetic heating; Electromagnetic radiation; Finite element methods; Magnetic fields; Packaging; Resistance heating; Thermal resistance; Very large scale integration; Voltage;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electromagnetic Compatibility, 1992. Symposium Record., IEEE 1992 International Symposium on
Conference_Location :
Anaheim, CA, USA
Print_ISBN :
0-7803-0713-5
Type :
conf
DOI :
10.1109/ISEMC.1992.626059
Filename :
626059
Link To Document :
https://search.ricest.ac.ir/dl/search/defaultta.aspx?DTC=49&DC=2878813
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