DocumentCode
2878917
Title
Low Cost Passive UHF RFID Packaging with Electromagnetic Band Gap (EBG) Substrate for Metal Objects
Author
Bo Gao ; Cheng, Chi Ho ; Yuen, M.M.F. ; Murch, Ross D.
Author_Institution
Hong Kong Univ. of Sci. & Technol., Kowloon
fYear
2007
fDate
May 29 2007-June 1 2007
Firstpage
974
Lastpage
978
Abstract
Passive UHF (Ultra High Frequency) RFID (Radio Frequency Identification) is a promising technology for products tracking in logistics or routing packages in supply chain. However, the RFID tag is significantly affected by objects surround it especially metallic objects. In this paper, we disclosed a new method using electromagnetic band gap (EBG) material to insulate the UHF RFID tag from backside objects, so that the tag could work on water surface and even metal. The design of EBG material for UHF RFID which operates at 915 MHz was discussed in this paper. An ultrathin (<1.5 mm) tag on metal with a gain of 4 dBi was achieved in simulation and a prototype of 2.93 mm thick RFID on metal tag was measured in experiment. The simulation results showed that the RFID tag still could be read on EBG substrate with a good gain (~4 dBi). The measurement results indicated that the read rang of RFID tag with EBG substrate could reach up to 4 meters on metal template.
Keywords
UHF devices; logistics; photonic band gap; radiofrequency identification; supply chains; EBG material; electromagnetic band gap substrate; logistics; low-cost passive UHF RFID packaging; metal objects; product tracking; radiofrequency identification; supply chain; ultrathin RFID tag; Costs; Frequency; Insulation life; Logistics; Metamaterials; Packaging; Passive RFID tags; Periodic structures; RFID tags; Radiofrequency identification;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronic Components and Technology Conference, 2007. ECTC '07. Proceedings. 57th
Conference_Location
Reno, NV
ISSN
0569-5503
Print_ISBN
1-4244-0985-3
Electronic_ISBN
0569-5503
Type
conf
DOI
10.1109/ECTC.2007.373915
Filename
4250001
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