DocumentCode
2879364
Title
Design, Fabrication and Testing of Miniaturised Wireless Inertial Measurement Units (IMU)
Author
Barton, J. ; Gonzalez, A. ; Buckley, J. ; Flynn, B.O. ; Mathuna, S. C O
Author_Institution
Tyndall Nat. Inst., Cork
fYear
2007
fDate
May 29 2007-June 1 2007
Firstpage
1143
Lastpage
1148
Abstract
This paper will describe the design, fabrication, operation, and test results of a miniature wireless inertial measurement unit (WIMU) with a form factor of 10 mm. Many types of Inertial Measurement Units(IMU) have been designed and manufactured by prominent companies such as Crossbow, Xsens, O NAVI and Honeywell, among many others. American GNC Corporation currently claims to have the world´s smallest IMU[1]. Most of these IMUs are aimed at aerospace and other types of navigation, which is why miniaturisation has not been a priority. However, with the onset and development of MEMS technology, novel applications have been found for those MEMS sensors employed in an IMU. Head mounted displays, Segways and mobile phones are among the new products taking advantage of miniaturised MEMS inertial sensors. The current WIMU development is a step along the roadmap of the AES team at Tyndall National Institute towards miniaturisation and works from the current standard, the 25 mm platform [2]. A 25 mm stacked SMT IMU has been successfully developed and tested [3,4]. The goal now is to develop an even smaller version of this IMU by using advanced technology such as flexible substrates and flip-chip technique. These miniaturised IMU´s are required for wearable and medical applications where size and weight are priorities. Our WIMU uses bare-die versions of off-the-shelf MEMS sensors. The Inertial Measurement Unit itself is designed to give full six degrees of freedom with 3-axis for each of the sensors-accelerometers, gyroscopes and magnetometers.
Keywords
flip-chip devices; microsensors; substrates; AES team; American GNC Corporation; Crossbow; Honeywell; MEMS technology; O NAVI; Tyndall National Institute; Xsens; flexible substrates; flip-chip technique; gyroscopes; magnetometers; miniaturised MEMS inertial sensors; miniaturised wireless inertial measurement units; off-the-shelf MEMS sensors; sensors-accelerometers; Displays; Fabrication; Magnetic heads; Manufacturing; Measurement units; Micromechanical devices; Mobile handsets; Navigation; Standards development; Testing;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronic Components and Technology Conference, 2007. ECTC '07. Proceedings. 57th
Conference_Location
Reno, NV
ISSN
0569-5503
Print_ISBN
1-4244-0985-3
Electronic_ISBN
0569-5503
Type
conf
DOI
10.1109/ECTC.2007.373939
Filename
4250025
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