• DocumentCode
    2879475
  • Title

    Efficient Simulation of Power/Ground Planes for SiP Applications

  • Author

    Bharath, Krishna ; Engin, Ege ; Swaminathan, Madhavan ; Uriu, Kazuhide ; Yamada, Toru

  • Author_Institution
    Georgia Inst. of Technol., Atlanta
  • fYear
    2007
  • fDate
    May 29 2007-June 1 2007
  • Firstpage
    1199
  • Lastpage
    1205
  • Abstract
    Packages for modern mixed signal systems in package (SiP) require split planes and power islands to isolate multiple power supplies. To reduce design iterations due to signal integrity issues, the frequency response of the package needs to be obtained accurately at an early stage of the design. Full-wave EM solvers are generally the most accurate tools available. However, the high time and memory required by such tools relegates their use to final verification, at which stage design iterations are expensive. The finite difference method has been shown to be efficient in simulating single plane-pair structures with slots as long as one plane is completely solid. Also, the multilayer finite difference method (M-FDM) can accurately model multilayer structures with apertures, so long as there are no power islands. In this paper, a formulation for efficient simulation of multilayer structures with split planes has been investigated. Further, a method by which transmission lines can be integrated with a power distribution network containing apertures and split planes has been discussed. The formulation has been validated by comparing results with full-wave EM simulations.
  • Keywords
    finite difference methods; frequency response; system-in-package; SiP applications; design iterations; frequency response; full-wave EM simulations; full-wave EM solvers; mixed signal system in package; multilayer finite difference method; power distribution network; power islands; power supplies; power/ground planes; signal integrity; transmission lines; Apertures; Finite difference methods; Frequency response; Nonhomogeneous media; Packaging; Power supplies; Power systems; Power transmission lines; Signal design; Solid modeling;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronic Components and Technology Conference, 2007. ECTC '07. Proceedings. 57th
  • Conference_Location
    Reno, NV
  • ISSN
    0569-5503
  • Print_ISBN
    1-4244-0985-3
  • Electronic_ISBN
    0569-5503
  • Type

    conf

  • DOI
    10.1109/ECTC.2007.373946
  • Filename
    4250032