DocumentCode
2879475
Title
Efficient Simulation of Power/Ground Planes for SiP Applications
Author
Bharath, Krishna ; Engin, Ege ; Swaminathan, Madhavan ; Uriu, Kazuhide ; Yamada, Toru
Author_Institution
Georgia Inst. of Technol., Atlanta
fYear
2007
fDate
May 29 2007-June 1 2007
Firstpage
1199
Lastpage
1205
Abstract
Packages for modern mixed signal systems in package (SiP) require split planes and power islands to isolate multiple power supplies. To reduce design iterations due to signal integrity issues, the frequency response of the package needs to be obtained accurately at an early stage of the design. Full-wave EM solvers are generally the most accurate tools available. However, the high time and memory required by such tools relegates their use to final verification, at which stage design iterations are expensive. The finite difference method has been shown to be efficient in simulating single plane-pair structures with slots as long as one plane is completely solid. Also, the multilayer finite difference method (M-FDM) can accurately model multilayer structures with apertures, so long as there are no power islands. In this paper, a formulation for efficient simulation of multilayer structures with split planes has been investigated. Further, a method by which transmission lines can be integrated with a power distribution network containing apertures and split planes has been discussed. The formulation has been validated by comparing results with full-wave EM simulations.
Keywords
finite difference methods; frequency response; system-in-package; SiP applications; design iterations; frequency response; full-wave EM simulations; full-wave EM solvers; mixed signal system in package; multilayer finite difference method; power distribution network; power islands; power supplies; power/ground planes; signal integrity; transmission lines; Apertures; Finite difference methods; Frequency response; Nonhomogeneous media; Packaging; Power supplies; Power systems; Power transmission lines; Signal design; Solid modeling;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronic Components and Technology Conference, 2007. ECTC '07. Proceedings. 57th
Conference_Location
Reno, NV
ISSN
0569-5503
Print_ISBN
1-4244-0985-3
Electronic_ISBN
0569-5503
Type
conf
DOI
10.1109/ECTC.2007.373946
Filename
4250032
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