• DocumentCode
    2879595
  • Title

    Suitably Patterned Thin Stiff Films as General Platforms for Flexible Electronics

  • Author

    Li, Teng

  • Author_Institution
    Maryland Univ., College Park
  • fYear
    2007
  • fDate
    May 29 2007-June 1 2007
  • Firstpage
    1230
  • Lastpage
    1234
  • Abstract
    We propose a general principle to make thin films of stiff materials compliant by suitably patterning. Such a principle is demonstrated by three patterns: a film in serpentine shape, a film with distributed branched cracks, and a film with distributed parallel cracks. We show that such a patterned film elongates by deflecting and twisting out of plane, accommodated by the compliance of the substrate and the pattern of the film. Consequently, large elongations of the substrate induce small strains in the film. We further propose that such a patterned film with large area can serve as a platform, on which entire electronic circuits can be fabricated using the planar microfabrication technology. Such circuits will function without appreciable fatigue when the substrate is repeatedly bent, twisted, and stretched.
  • Keywords
    thin film circuits; flexible electronics; patterned thin stiff films; planar microfabrication technology; Capacitive sensors; Dielectric materials; Electronic circuits; Flexible electronics; Semiconductor materials; Shape; Substrates; Textile technology; Thin film circuits; Transistors;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronic Components and Technology Conference, 2007. ECTC '07. Proceedings. 57th
  • Conference_Location
    Reno, NV
  • ISSN
    0569-5503
  • Print_ISBN
    1-4244-0985-3
  • Electronic_ISBN
    0569-5503
  • Type

    conf

  • DOI
    10.1109/ECTC.2007.373951
  • Filename
    4250037