DocumentCode
2879595
Title
Suitably Patterned Thin Stiff Films as General Platforms for Flexible Electronics
Author
Li, Teng
Author_Institution
Maryland Univ., College Park
fYear
2007
fDate
May 29 2007-June 1 2007
Firstpage
1230
Lastpage
1234
Abstract
We propose a general principle to make thin films of stiff materials compliant by suitably patterning. Such a principle is demonstrated by three patterns: a film in serpentine shape, a film with distributed branched cracks, and a film with distributed parallel cracks. We show that such a patterned film elongates by deflecting and twisting out of plane, accommodated by the compliance of the substrate and the pattern of the film. Consequently, large elongations of the substrate induce small strains in the film. We further propose that such a patterned film with large area can serve as a platform, on which entire electronic circuits can be fabricated using the planar microfabrication technology. Such circuits will function without appreciable fatigue when the substrate is repeatedly bent, twisted, and stretched.
Keywords
thin film circuits; flexible electronics; patterned thin stiff films; planar microfabrication technology; Capacitive sensors; Dielectric materials; Electronic circuits; Flexible electronics; Semiconductor materials; Shape; Substrates; Textile technology; Thin film circuits; Transistors;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronic Components and Technology Conference, 2007. ECTC '07. Proceedings. 57th
Conference_Location
Reno, NV
ISSN
0569-5503
Print_ISBN
1-4244-0985-3
Electronic_ISBN
0569-5503
Type
conf
DOI
10.1109/ECTC.2007.373951
Filename
4250037
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