OE Device Integration for Optically Enabled MCM

Author

Taira, Yoichi ; Numata, Hidetoshi ; Yamada, Fumiaki ; Katayama, Yasunao ; Nakagawa, Shigeru ; Hasegawa, Masaki ; Terada, Kenji ; Tsukada, Yutaka

Author_Institution

IBM Res., Yamato

fYear

2007

fDate

May 29 2007-June 1 2007

Firstpage

1262

Lastpage

1267

Abstract

We propose a new architecture of optical device integration on SLC carrier with capability of handling of the optical signals directly on MCM, or an optically enabled MCM, where VCSELs/PDs and the interface chips are placed closer to the main VLSI on a waveguide integrated SLC, while the optical connectors are at the periphery of the SLC carrier. This separated structure allows the highest number of optical channels per periphery length defined by the connector size, as well as the higher optical speed.

Keywords

multichip modules; optical fibres; OE device integration; SLC carrier; VCSEL-PD; VLSI; interface chips; optical connectors; optical device integration; optical signals; optically enabled MCM; waveguide integrated SLC; Bandwidth; Connectors; Electrooptical waveguides; High speed optical techniques; Integrated circuit interconnections; Integrated optics; Optical devices; Optical interconnections; Optical network units; Optical waveguides;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronic Components and Technology Conference, 2007. ECTC '07. Proceedings. 57th

Conference_Location

Reno, NV

ISSN

0569-5503

Print_ISBN

1-4244-0985-3

Electronic_ISBN

0569-5503

Type

conf

DOI

10.1109/ECTC.2007.373957

Filename

4250043