• DocumentCode
    2879714
  • Title

    Demonstration of High Frequency Data Link on FR4 Printed Circuit Board Using Optical Waveguides

  • Author

    Lim, Teck Guan ; Lee, Bryan Sik Pong ; Shioda, Tsuyoshi ; Kuruveettil, Haridas ; Li, Jing ; Suzuki, Kenji ; Fujita, Kazuhito ; Yamada, Kazuhiro ; Ramana, Pamidighantam V.

  • Author_Institution
    Inst. of Microelectron., Singapore
  • fYear
    2007
  • fDate
    May 29 2007-June 1 2007
  • Firstpage
    1268
  • Lastpage
    1274
  • Abstract
    We report the development of a low cost, simple optical circuit board (OECB) using large core multi mode polymer waveguide on FR4 printed circuit board (PCB). The design of this OECB uses only a 45deg-ended waveguide to couple and decouple the optical signal directly between the optical devices and the waveguide. The 45deg mirror is formed using excimer laser process on a multi mode waveguide with temperature stability at reflow temperature. The optical waveguide is attached to a diced channel in the FR4 PCB using adhesive to form a completely planar circuit. This allows the laser diode and the photodiode to be assembled directly above the input and output of the waveguide using precision flip chip technology, which provides good alignment accuracy. This helps to increase the mechanical reliability of the circuit and minimize assembly requirements. Most importantly, all the electronic and optoelectronic devices used are commercially available components, the FR4 PCB fabrication process is standard process, the component assembly process is normal reflow process and the method is amenable for manufacturing. In the present publication, we report the details of the design, assembly process, high accuracy optical device attachment, performance characterization and testing results.
  • Keywords
    flip-chip devices; integrated optoelectronics; microassembling; optical interconnections; optical polymers; optical waveguides; photodiodes; printed circuit design; printed circuit manufacture; FR4 printed circuit board; PCB fabrication process; assembly requirements; component assembly process; excimer laser process; high frequency data link; laser diode; mechanical reliability; multi mode polymer waveguide; optical circuit board; optical waveguides; optoelectronic devices; photodiode; precision flip chip technology; reflow process; temperature stability; Assembly; Costs; Frequency; Laser stability; Optical design; Optical devices; Optical polymers; Optical waveguides; Printed circuits; Temperature;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronic Components and Technology Conference, 2007. ECTC '07. Proceedings. 57th
  • Conference_Location
    Reno, NV
  • ISSN
    0569-5503
  • Print_ISBN
    1-4244-0985-3
  • Electronic_ISBN
    0569-5503
  • Type

    conf

  • DOI
    10.1109/ECTC.2007.373958
  • Filename
    4250044