DocumentCode
2879735
Title
Embedding of Optical Interconnections in Flexible Electronics
Author
Bosman, E. ; Van Steenberge, G. ; Geerinck, P. ; Christiaens, W. ; Vanfleteren, J. ; Van Daele, P.
Author_Institution
Ghent Univ., Ghent
fYear
2007
fDate
May 29 2007-June 1 2007
Firstpage
1281
Lastpage
1287
Abstract
This paper describes the development of a flexible substrate or foil in which optical waveguides, light sources, detectors, and electronic circuitry are embedded. The generic technology offers an integrated solution to the increasing demand for flexible optical sensors and creates a technology platform for the establishment of flexible high-speed optical data connections, based on optical wave guiding layers. Patterning of the optical waveguiding is done using both a standard photolithography process and laser ablation. The resulting opto-electrical foil shows very good flexible behavior and low optical propagation and bending losses.
Keywords
flexible electronics; high-speed optical techniques; laser ablation; light propagation; optical interconnections; optical sensors; optical waveguides; photolithography; bending losses; detectors; electronic circuitry; flexible electronics; flexible optical sensors; high-speed optical data connections; laser ablation; light sources; optical interconnections; optical propagation; optical wave guiding layers; optical waveguides; optical waveguiding; opto-electrical foil; photolithography process; Flexible electronics; Flexible printed circuits; High speed optical techniques; Integrated circuit technology; Integrated optics; Light sources; Lithography; Optical interconnections; Optical sensors; Optical waveguides;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronic Components and Technology Conference, 2007. ECTC '07. Proceedings. 57th
Conference_Location
Reno, NV
ISSN
0569-5503
Print_ISBN
1-4244-0985-3
Electronic_ISBN
0569-5503
Type
conf
DOI
10.1109/ECTC.2007.373960
Filename
4250046
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