• DocumentCode
    2879735
  • Title

    Embedding of Optical Interconnections in Flexible Electronics

  • Author

    Bosman, E. ; Van Steenberge, G. ; Geerinck, P. ; Christiaens, W. ; Vanfleteren, J. ; Van Daele, P.

  • Author_Institution
    Ghent Univ., Ghent
  • fYear
    2007
  • fDate
    May 29 2007-June 1 2007
  • Firstpage
    1281
  • Lastpage
    1287
  • Abstract
    This paper describes the development of a flexible substrate or foil in which optical waveguides, light sources, detectors, and electronic circuitry are embedded. The generic technology offers an integrated solution to the increasing demand for flexible optical sensors and creates a technology platform for the establishment of flexible high-speed optical data connections, based on optical wave guiding layers. Patterning of the optical waveguiding is done using both a standard photolithography process and laser ablation. The resulting opto-electrical foil shows very good flexible behavior and low optical propagation and bending losses.
  • Keywords
    flexible electronics; high-speed optical techniques; laser ablation; light propagation; optical interconnections; optical sensors; optical waveguides; photolithography; bending losses; detectors; electronic circuitry; flexible electronics; flexible optical sensors; high-speed optical data connections; laser ablation; light sources; optical interconnections; optical propagation; optical wave guiding layers; optical waveguides; optical waveguiding; opto-electrical foil; photolithography process; Flexible electronics; Flexible printed circuits; High speed optical techniques; Integrated circuit technology; Integrated optics; Light sources; Lithography; Optical interconnections; Optical sensors; Optical waveguides;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronic Components and Technology Conference, 2007. ECTC '07. Proceedings. 57th
  • Conference_Location
    Reno, NV
  • ISSN
    0569-5503
  • Print_ISBN
    1-4244-0985-3
  • Electronic_ISBN
    0569-5503
  • Type

    conf

  • DOI
    10.1109/ECTC.2007.373960
  • Filename
    4250046