Surface Micro-patterning with Self-assembled Monolayers Selectively Deposited on Copper Substrates by Ink-jet Printing

Ink jet printing of self-assembled monolayers (SAMs) on copper provides a potential route to the digital manufacture of patterned tracks and micro-fabricated devices. However, forming a SAM layer using conventional solution methods is challenging due to the native oxide layer on copper, and this issue is magnified for ink-jet printing, where the oxide layer must be removed, without rendering the substrate unsuitable for high resolution printing. In this study, ink-jet patterning of SAMs on copper is reported. The correlation between oxide removal method and print resolution and SAM distribution within a deposited drop is investigated. In addition, the quality of the deposited layer is assessed using a variety of approaches including surface energy measurement.