Fiber Optic Strain and Structural Health Monitoring in Polymer Electronic Packaging

Packaging and curing induced stresses are the starting points for all further electronic reliability estimations (L.J. Ernst, 2000). Strain measurement in epoxy polymers during molding and curing is presented by use of embedded fiber optic Bragg grating (FBG) sensors. By mechanical coupling between polymer and fiber the FBG sensor enables monitoring of encapsulation induced strains and forces acting on the embedded electrical components. Determination of gel point and material shrinkage is possible directly in the mechanical environment of the product and production line as well as structural health monitoring of the encapsulated electronic components. It is shown that the grating is able to detect delaminations within the polymer during curing and post curing processes. We successfully tested fiber optic strain sensors in industrial transfer molding processes.