DocumentCode
2880547
Title
Wafer Level Assembly Methods for Complex Pathway Micro-Fluidic PCR Reactor
Author
Stoffel, Nancy ; Fisher, Almon ; Tan, Songsheng ; Boysel, Mark ; Grover, Joel W. ; Juncosa, Robert
Author_Institution
Infotonics Technol. Center, Canandaigua
fYear
2007
fDate
May 29 2007-June 1 2007
Firstpage
1561
Lastpage
1566
Abstract
Micro-fluidic devices were fabricated that amplify DNA segments using the polymerase chain reaction (PCR). These devices employ a unique passive heating methodology that provides ultra-fast fluidic temperature transitions. The devices consist of alternating layers of thermally conductive and insulative layers. The highly thermally conductive layers consist of silicon etched to form vias and micro-channels. The thermally insulative layers were made of polyetherimide layers with laser ablated vias. Individual layers of materials were aligned and joined together to create this device. Novel joining technologies developed for the project included the epoxy specifically targeted for adhesive printing and the mechanical alignment methods. A custom formulated epoxy was created to give a submicron bond line that is controllable, strong, and highly resistant to aqueous and solvent exposure. The bonding temperature was less than 200degC, creating leak-free continuous micro-fluidic pathways. Biocompatible coatings were applied to the entire length of the 600 mm internal pathway before use. The device was used to successfully demonstrate PCR reaction times of less than 5 minutes; this is in comparison to the conventional methods which take several hours.
Keywords
DNA; assembling; bioMEMS; bioreactors; microfluidics; microreactors; wafer level packaging; DNA segments; adhesive printing; biocompatible coatings; laser ablated vias; mechanical alignment methods; microchannels; microfluidic PCR reactor; microfluidic devices; passive heating methodology; polyetherimide layers; polymerase chain reaction; thermally conductive layers; thermally insulative layers; ultrafast fluidic temperature transitions; wafer level assembly methods; Assembly; Bonding; DNA; Heating; Inductors; Insulation; Polymers; Silicon; Temperature; Thermal conductivity;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronic Components and Technology Conference, 2007. ECTC '07. Proceedings. 57th
Conference_Location
Reno, NV
ISSN
0569-5503
Print_ISBN
1-4244-0985-3
Electronic_ISBN
0569-5503
Type
conf
DOI
10.1109/ECTC.2007.374003
Filename
4250089
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