Title :
Highly miniaturized vertical end-fire antenna array for mmWave wireless communication
Author :
Kwang-Hyun Baek ; Wonbin Hong
Author_Institution :
DMC R&D Center, Samsung Electron., Suwon, South Korea
Abstract :
This paper demonstrates a novel end-fire antenna array solution applicable for millimeter (mmWave) wireless communications. Previously existing antenna solutions are either confined to broadside radiation or require a bulky ground fill cut space underneath the antenna which commonly limits the feasibility of end-fire antennas. In contrast, the salient feature of the devised antenna array is in fact that end-fire radiation is retained despite being in very close proximity to the ground plane. The proposed shorted monopole antenna array consists of a series of vias, alleviating the fabrication complexity and form factor. The antenna lamination consists of 10-layered Printed Circuit boards (PCB) with a total thickness of 622um. Simulation results indicate the featured 6dB S11 bandwidth to range from 77.6 - 82.2 GHz with peak gain of 4.45 dBi at 80 GHz. |S21| between identical antenna arrays separated along the horizontal plane by 10mm is determined to be -32 dB at 80 GHz.
Keywords :
antenna radiation patterns; bandwidth allocation; channel allocation; microprocessor chips; millimetre wave antenna arrays; monopole antenna arrays; printed circuits; wireless LAN; 10-layered printed circuit boards; PCB; WiFi; antenna lamination; bandwidth 77.6 GHz to 82.2 GHz; bandwidth 80 GHz; broadside radiation; bulky ground fill cut space; channel bandwidth allocations; end-fire radiation; fabrication complexity; form factor; gain 4.45 dB; highly miniaturized vertical end-fire antenna array; identical antenna arrays; millimeter wireless communications; mm wave wireless communication; monopole antenna array; multichip system; vias, series; Antenna arrays; Antenna radiation patterns; Arrays; Bandwidth; Wireless communication; Yagi-Uda antennas;
Conference_Titel :
Antennas and Propagation Society International Symposium (APSURSI), 2013 IEEE
Conference_Location :
Orlando, FL
Print_ISBN :
978-1-4673-5315-1
DOI :
10.1109/APS.2013.6711156