DocumentCode
2880872
Title
Premold on Substrate for MEMS Package
Author
Wang, Meng-Jen ; Yang, Kuo-Bin ; Peng, Sheng-Yang ; Hsiao, Wei-Min ; Wang, Feng-Yan ; Wang, Wei-Chung
Author_Institution
Adv. Semicond. Eng. Inc., Kaohsiung
fYear
2007
fDate
May 29 2007-June 1 2007
Firstpage
1673
Lastpage
1677
Abstract
A pre-mold cavity package for MEMS application had been successfully demonstrated, with the technology of premold on substrate, modules combining MEMS chips, integrated circuits, passives can easily be fulfilled in either LGA or BGA format. Furthermore, the batch and cost effective transfer molding process could facilitate the low cost package for commercial MEMS application.
Keywords
ball grid arrays; chip scale packaging; micromechanical devices; substrates; transfer moulding; BGA format; LGA format; MEMS chips; MEMS package; integrated circuits; pre-mold cavity package; substrate; transfer molding; Application specific integrated circuits; Costs; Integrated circuit packaging; Integrated circuit technology; Micromechanical devices; Microphones; Plastic packaging; Semiconductor device packaging; Substrates; Wafer scale integration;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronic Components and Technology Conference, 2007. ECTC '07. Proceedings. 57th
Conference_Location
Reno, NV
ISSN
0569-5503
Print_ISBN
1-4244-0985-3
Electronic_ISBN
0569-5503
Type
conf
DOI
10.1109/ECTC.2007.374019
Filename
4250105
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