Title :
Premold on Substrate for MEMS Package
Author :
Wang, Meng-Jen ; Yang, Kuo-Bin ; Peng, Sheng-Yang ; Hsiao, Wei-Min ; Wang, Feng-Yan ; Wang, Wei-Chung
Author_Institution :
Adv. Semicond. Eng. Inc., Kaohsiung
fDate :
May 29 2007-June 1 2007
Abstract :
A pre-mold cavity package for MEMS application had been successfully demonstrated, with the technology of premold on substrate, modules combining MEMS chips, integrated circuits, passives can easily be fulfilled in either LGA or BGA format. Furthermore, the batch and cost effective transfer molding process could facilitate the low cost package for commercial MEMS application.
Keywords :
ball grid arrays; chip scale packaging; micromechanical devices; substrates; transfer moulding; BGA format; LGA format; MEMS chips; MEMS package; integrated circuits; pre-mold cavity package; substrate; transfer molding; Application specific integrated circuits; Costs; Integrated circuit packaging; Integrated circuit technology; Micromechanical devices; Microphones; Plastic packaging; Semiconductor device packaging; Substrates; Wafer scale integration;
Conference_Titel :
Electronic Components and Technology Conference, 2007. ECTC '07. Proceedings. 57th
Conference_Location :
Reno, NV
Print_ISBN :
1-4244-0985-3
Electronic_ISBN :
0569-5503
DOI :
10.1109/ECTC.2007.374019
