Title :
Low-Cost Hybrid WDM Module Integrated on Planar Lightwave Circuit (PLC) with a Coated WDM Filter Using Passive Alignment Technique
Author :
Lim, Jung Woon ; Hwang, Sung Hwan ; Kim, Seon Hoon ; Kim, Boo-Gyoun ; Rho, Byung Sup
Author_Institution :
Korea Photonics Technol. Inst., Gwangju
fDate :
May 29 2007-June 1 2007
Abstract :
We have developed a low cost 1.25 Gbps WDM bidirectional module using two integrated optical subassemblies which are composed of a planar lightwave circuit (PLC) platform and a silicon optical bench (SiOB) platform. The low cost module is achieved by employing a flip-chip bonding method with passive alignment using a Fabry-Perot laser diode (FP-LD) with a monitoring waveguide-photodiode (PD) on a PLC platform and a receiver with a PIN-PD on a SiOB platform. We also observed the optical coupling loss between laser diode and waveguide and the performance of receiver sub-assembly.
Keywords :
assembling; flip-chip devices; integrated circuit bonding; integrated optoelectronics; optical communication equipment; optical waveguide filters; p-i-n photodiodes; semiconductor lasers; wavelength division multiplexing; FP-LD; Fabry-Perot laser diode; PIN-PD; PLC; SiOB platform; WDM bidirectional module; WDM filter; bit rate 1.25 Gbit/s; flip-chip bonding method; hybrid WDM module; integrated optical subassemblies; optical coupling loss; passive alignment technique; planar lightwave circuit; receiver sub-assembly; silicon optical bench platform; waveguide-photodiode; Circuits; Costs; Diode lasers; Integrated optics; Optical filters; Optical receivers; Optical waveguides; Passive filters; Programmable control; Wavelength division multiplexing;
Conference_Titel :
Electronic Components and Technology Conference, 2007. ECTC '07. Proceedings. 57th
Conference_Location :
Reno, NV
Print_ISBN :
1-4244-0985-3
Electronic_ISBN :
0569-5503
DOI :
10.1109/ECTC.2007.374069
