DocumentCode
2881930
Title
Design of On-Chip Microchannel Fluidic Cooling Structures
Author
Zhao, Mingyuan ; Huang, Z. Rena
Author_Institution
Rensselaer Polytech. Inst., Troy
fYear
2007
fDate
May 29 2007-June 1 2007
Firstpage
2017
Lastpage
2023
Abstract
In this paper, we present five designs of microchannel fluidic cooling structures formed on a Si chip representing the heat source. The numerical simulation is performed by the software package of COMSOL multiphysics, formerly FEMLAB. The fabrication process of the microchannel structure will also be discussed.
Keywords
microchannel flow; microfluidics; numerical analysis; silicon; software packages; COMSOL multiphysics; FEMLAB; Si; heat source; microchannel fluidic cooling structure design; numerical simulation; software package; Copper; Electronics cooling; Fluidic microsystems; Heat sinks; Microchannel; Microfluidics; Numerical simulation; Polymers; Software packages; Trigeneration;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronic Components and Technology Conference, 2007. ECTC '07. Proceedings. 57th
Conference_Location
Reno, NV
ISSN
0569-5503
Print_ISBN
1-4244-0985-3
Electronic_ISBN
0569-5503
Type
conf
DOI
10.1109/ECTC.2007.374079
Filename
4250165
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