Title :
Design of On-Chip Microchannel Fluidic Cooling Structures
Author :
Zhao, Mingyuan ; Huang, Z. Rena
Author_Institution :
Rensselaer Polytech. Inst., Troy
fDate :
May 29 2007-June 1 2007
Abstract :
In this paper, we present five designs of microchannel fluidic cooling structures formed on a Si chip representing the heat source. The numerical simulation is performed by the software package of COMSOL multiphysics, formerly FEMLAB. The fabrication process of the microchannel structure will also be discussed.
Keywords :
microchannel flow; microfluidics; numerical analysis; silicon; software packages; COMSOL multiphysics; FEMLAB; Si; heat source; microchannel fluidic cooling structure design; numerical simulation; software package; Copper; Electronics cooling; Fluidic microsystems; Heat sinks; Microchannel; Microfluidics; Numerical simulation; Polymers; Software packages; Trigeneration;
Conference_Titel :
Electronic Components and Technology Conference, 2007. ECTC '07. Proceedings. 57th
Conference_Location :
Reno, NV
Print_ISBN :
1-4244-0985-3
Electronic_ISBN :
0569-5503
DOI :
10.1109/ECTC.2007.374079
