Mixed mode fracture toughness characterization for interface and interlayer cracks in adhesive bonded joints

Author

Pang, H.L.J. ; Bong, S.N. ; Shi, X.Q. ; Wang, Z.P.

Author_Institution

Sch. of Mech. & Production Eng., Nanyang Technol. Univ., Singapore

fYear

2000

fDate

2000

Firstpage

197

Lastpage

200

Abstract

An approach based on fracture mechanics was employed to assess adhesive bond failure. Two types of fracture specimens were investigated. The Brazil nut sandwich (BNS) specimen and the compact mixed mode (CMM) specimen were used to determined the fracture toughness of adhesive joints. Fracture toughness measurements for interface crack and interlayer crack specimens were investigated. Mixed mode fracture criteria for interface or interlayer cracks in adhesive bonded joints were developed. The results showed that the mode II fracture toughness generally displayed a larger value than the mode I toughness. In the case of the CMM specimen, fracture toughness for interface crack feature toughness is lower than that for a cohesive interlayer crack failure. Failure analysis diagrams were generated for both interlayer and interface crack configurations

Keywords

adhesives; cracks; failure analysis; fracture mechanics; fracture toughness testing; integrated circuit interconnections; integrated circuit packaging; interface structure; internal stresses; Brazil nut sandwich specimen; CMM specimen; adhesive bond failure; adhesive bonded joints; adhesive joints; cohesive interlayer crack failure; compact mixed mode specimen; failure analysis diagrams; fracture mechanics; fracture specimens; fracture toughness; fracture toughness measurements; interface crack configurations; interface crack feature toughness; interface crack specimens; interface cracks; interlayer crack configurations; interlayer crack specimens; interlayer cracks; mixed mode fracture criteria; mixed mode fracture toughness; mode I fracture toughness; mode II fracture toughness; Assembly; Bonding; Capacitive sensors; Coordinate measuring machines; Electronics packaging; Failure analysis; Joining materials; Manufacturing; Production engineering; Stress;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronic Materials and Packaging, 2000. (EMAP 2000). International Symposium on

Conference_Location

Hong Kong

Print_ISBN

0-7803-6654-9

Type

conf

DOI

10.1109/EMAP.2000.904154

Filename

904154