• DocumentCode
    2882801
  • Title

    Experiences In Deep Sub-Micron Scan-Based At-Speed Delay Testing

  • Author

    Lee, Jih-Nung ; Yeh, Ta-Chia ; Wu, Chi-Feng ; Hwang, Shih-Arn ; Lee, Chao-Cheng

  • Author_Institution
    Realtek Semicond. Corp, Hsinchu
  • fYear
    2006
  • fDate
    26-28 April 2006
  • Firstpage
    1
  • Lastpage
    4
  • Abstract
    As semiconductor process technologies keep improving, more and more high frequency chips will be designed and manufactured. Testing of timing-related defects thus is becoming essential to guarantee high quality deep sub-micron products. In this paper, we presented our experiences in scan-based at-speed delay testing. Based on transition delay and path delay fault model, we enhance the traditional production test flow with scan-based at-speed delay tests. To test chips at operational speed, we designed an on-chip test clock generator to generate at-speed launch-capture clock pulses. Therefore, high-speed testers will not be required. Commercial EDA tools are used for test pattern generation and timing analysis. In addition, stress test flow is proposed to enhance the test quality. Experimental results show that our approach can detect delay defects, which can be correlated with results of at-speed functional tests
  • Keywords
    automatic test pattern generation; boundary scan testing; integrated circuit modelling; integrated circuit testing; deep sub-micron testing; high frequency chips; launch-capture clock pulses; path delay fault model; production test flow; scan-based at-speed delay testing; semiconductor process technologies; stress test flow; test clock generator; test pattern generation; timing analysis; timing-related defects; transition delay model; Clocks; Delay; Electronic design automation and methodology; Frequency; Manufacturing processes; Production; Pulse generation; Semiconductor device manufacture; Semiconductor process modeling; Testing;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    VLSI Design, Automation and Test, 2006 International Symposium on
  • Conference_Location
    Hsinchu
  • Print_ISBN
    1-4244-0179-8
  • Electronic_ISBN
    1-4244-0180-1
  • Type

    conf

  • DOI
    10.1109/VDAT.2006.258112
  • Filename
    4027484