• DocumentCode
    2883921
  • Title

    High speed optoelectronic packaging techniques

  • Author

    Firth, P. ; Fraser, J. ; Ayliffe, P. ; Kimber, E.M.

  • Author_Institution
    Nortel Networks plc, Paignton, UK
  • fYear
    1999
  • fDate
    1999
  • Firstpage
    42614
  • Lastpage
    42619
  • Abstract
    We have shown that with careful design, utilising short wire bonds and controlled impedance tracks, a type of low cost ceramic packaging for high bit rate opto-electronic systems is suitable for use up to 5 Gb/s. A design for a 10 Gb/s transmitter will require a package with more bandwidth and electro-optic components with smaller residual RC components
  • Keywords
    ceramic packaging; 5 Gbit/s; ceramic packaging; high speed optoelectronic system; impedance track; transmitter; wire bond;
  • fLanguage
    English
  • Publisher
    iet
  • Conference_Titel
    Opto-Electronic Interfacing at Microwave Frequencies (Ref. No. 1999/045), IEE Colloquium on
  • Conference_Location
    London
  • Type

    conf

  • DOI
    10.1049/ic:19990236
  • Filename
    771945
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=2883921