DocumentCode :
2884358
Title :
Complementary silicide source/drain thin-body MOSFETs for the 20 nm gate length regime
Author :
Kedzierski, J. ; Xuan, P. ; Anderson, E.H. ; Bokor, J. ; Tsu-Jae King ; Chenming Hu
Author_Institution :
Dept. of Electr. Eng. & Comput. Sci., California Univ., Berkeley, CA, USA
fYear :
2000
fDate :
10-13 Dec. 2000
Firstpage :
57
Lastpage :
60
Abstract :
Thin-body transistors with silicide source/drains were fabricated with gate-lengths down to 15 nm. Complementary low-barrier silicides were used to reduce contact and series resistance. Minimum gate-length transistors with T/sub ox/=40 /spl Aring/ show PMOS |I/sub dsat/|=270 /spl mu/A//spl mu/m and NMOS |I/sub dsat/|=190 /spl mu/A//spl mu/m with V/sub ds/=1.5 V, |V/sub g/-V/sub t/|=1.2 V and, I/sub on//I/sub off/>10/sup 4/. A simple transmission model, fitted to experimental data, is used to investigate effects of oxide scaling and extension doping.
Keywords :
MOSFET; contact resistance; semiconductor device models; semiconductor doping; 1.2 V; 1.5 V; 15 to 20 nm; complementary low-barrier silicides; contact resistance; extension doping; gate length; oxide scaling; series resistance; silicide source/drain thin-body MOSFETs; transmission model; Annealing; Doping; Etching; Immune system; Lithography; MOS devices; MOSFETs; Optical films; Resists; Silicides;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electron Devices Meeting, 2000. IEDM '00. Technical Digest. International
Conference_Location :
San Francisco, CA, USA
Print_ISBN :
0-7803-6438-4
Type :
conf
DOI :
10.1109/IEDM.2000.904258
Filename :
904258
Link To Document :
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