DocumentCode :
2884977
Title :
Reliability of low temperature poly-Si TFT employing counter-doped lateral body terminal
Author :
Yoo, J.S. ; Kim, C.H. ; Lee, M.C. ; Han, M.K. ; Kim, H.J.
Author_Institution :
Sch. of Electr. Eng., Seoul Nat. Univ., South Korea
fYear :
2000
fDate :
10-13 Dec. 2000
Firstpage :
217
Lastpage :
220
Abstract :
A new low-temperature poly-Si TFT employing a counter-doped lateral body terminal is proposed and fabricated, in order to enhance the stability of poly-Si driving circuits. The LBT structure effectively suppresses the kink effect by collecting the counter-polarity carriers and suppresses the hot carrier effect by reducing the peak lateral field at the drain junction. The proposed device is immune to dynamic stress, so that it is suitable for low voltage and high speed driving circuits of AMLCD.
Keywords :
CMOS integrated circuits; driver circuits; elemental semiconductors; laser beam annealing; reliability; silicon; stability; thin film transistors; AMLCD; counter-doped lateral body terminal; counter-polarity; drain junction; dynamic stress; high speed driving circuits; hot carrier effect; low temperature poly-Si TFT; peak lateral field; poly-Si driving circuits; reliability; stability; Active matrix liquid crystal displays; Circuit stability; Degradation; Electron traps; Fabrication; Immune system; Stress; Temperature; Thin film transistors; Threshold voltage;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electron Devices Meeting, 2000. IEDM '00. Technical Digest. International
Conference_Location :
San Francisco, CA, USA
Print_ISBN :
0-7803-6438-4
Type :
conf
DOI :
10.1109/IEDM.2000.904296
Filename :
904296
Link To Document :
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