• DocumentCode
    2885388
  • Title

    Substrate enhanced degradation of CMOS devices

  • Author

    Driussi, F. ; Esseni, D. ; Selmi, L. ; Piazza, F.

  • Author_Institution
    DIEGM, Udine Univ., Italy
  • fYear
    2000
  • fDate
    10-13 Dec. 2000
  • Firstpage
    323
  • Lastpage
    326
  • Abstract
    This paper investigates hot carrier induced nMOS and pMOS degradation in the presence of a substrate bias and compares the results with those of the conventional Channel Hot Carrier (CHC) regime. Stress experiments and detailed characterizations (including spatial profiling of the damage) were carried out on state of the art n/sup +/-poly n-MOSFETs and p/sup +/-poly p-MOSFETs. Results reveal that upon application of a substrate bias degradation becomes faster and more distributed towards the channel than in the channel hot carrier regime.
  • Keywords
    MOSFET; hot carriers; semiconductor device measurement; semiconductor device reliability; CMOS devices; channel hot carrier regime; hot carrier induced degradation; n/sup +/-poly n-MOSFETs; nMOS degradation; p/sup +/-poly p-MOSFETs; pMOS degradation; spatial profiling; substrate enhanced degradation; CMOS technology; Charge carrier processes; Degradation; Hot carriers; Impact ionization; MOS devices; MOSFET circuits; Stress; Substrate hot electron injection; Voltage;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electron Devices Meeting, 2000. IEDM '00. Technical Digest. International
  • Conference_Location
    San Francisco, CA, USA
  • Print_ISBN
    0-7803-6438-4
  • Type

    conf

  • DOI
    10.1109/IEDM.2000.904321
  • Filename
    904321