DocumentCode
2885388
Title
Substrate enhanced degradation of CMOS devices
Author
Driussi, F. ; Esseni, D. ; Selmi, L. ; Piazza, F.
Author_Institution
DIEGM, Udine Univ., Italy
fYear
2000
fDate
10-13 Dec. 2000
Firstpage
323
Lastpage
326
Abstract
This paper investigates hot carrier induced nMOS and pMOS degradation in the presence of a substrate bias and compares the results with those of the conventional Channel Hot Carrier (CHC) regime. Stress experiments and detailed characterizations (including spatial profiling of the damage) were carried out on state of the art n/sup +/-poly n-MOSFETs and p/sup +/-poly p-MOSFETs. Results reveal that upon application of a substrate bias degradation becomes faster and more distributed towards the channel than in the channel hot carrier regime.
Keywords
MOSFET; hot carriers; semiconductor device measurement; semiconductor device reliability; CMOS devices; channel hot carrier regime; hot carrier induced degradation; n/sup +/-poly n-MOSFETs; nMOS degradation; p/sup +/-poly p-MOSFETs; pMOS degradation; spatial profiling; substrate enhanced degradation; CMOS technology; Charge carrier processes; Degradation; Hot carriers; Impact ionization; MOS devices; MOSFET circuits; Stress; Substrate hot electron injection; Voltage;
fLanguage
English
Publisher
ieee
Conference_Titel
Electron Devices Meeting, 2000. IEDM '00. Technical Digest. International
Conference_Location
San Francisco, CA, USA
Print_ISBN
0-7803-6438-4
Type
conf
DOI
10.1109/IEDM.2000.904321
Filename
904321
Link To Document