DocumentCode :
2885604
Title :
Characteristics of AlGaN/GaN HEMT devices with SiN passivation
Author :
Jong-Soo Lee ; Vescan, A. ; Wieszt, A. ; Dietrich, R. ; Leier, H. ; Young-Se Kwon
Author_Institution :
Res. & Technol., Daimler-Chrysler AG, Ulm, Germany
fYear :
2000
fDate :
10-13 Dec. 2000
Firstpage :
381
Lastpage :
384
Abstract :
This paper demonstrates the effect of surface passivation on the DC and L-band power characteristics of doped AlGaN/GaN HEMT devices. Drain current and transconductance of AlGaN/GaN increase from 610 mA/mm to 690 mA/mm and 15O mS/mm to 170 mS/mm, whereas other measurements such as Hall and TLM show little change with SiN passivation. Output power dramatically increases from 0.59 W/mm to 1.45 mW/mm. The influence of the SiN layer on the bias dependence of the RF-output power is investigated.
Keywords :
aluminium compounds; gallium compounds; high electron mobility transistors; passivation; silicon compounds; 0.59 W/mm to 1.45 mW/mm; AlGaN-GaN; AlGaN/GaN HEMT devices; Hall; L-band power characteristics; RF-output power; SiN; SiN passivation; TLM; bias dependence; doped AlGaN/GaN HEMT devices; drain current 610 mA/mm to 690 mA/mm; surface passivation; transconductance 15O mS/mm to 170 mS/mm; Aluminum gallium nitride; Charge carrier density; Gallium nitride; HEMTs; Passivation; Power generation; Radio frequency; Silicon compounds; Substrates; Transconductance;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electron Devices Meeting, 2000. IEDM '00. Technical Digest. International
Conference_Location :
San Francisco, CA, USA
Print_ISBN :
0-7803-6438-4
Type :
conf
DOI :
10.1109/IEDM.2000.904336
Filename :
904336
Link To Document :
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