DocumentCode
2886541
Title
Study of Test Structures for Use as Reference Materials for Optical Critical Dimension Applications
Author
Allen, Richard A. ; Patrick, Heather J. ; Bishop, Michael ; Germer, Thomas A. ; Dixson, Ronald ; Guthrie, William F. ; Cresswell, Michael W.
Author_Institution
Nat. Inst. of Stand. & Technol., Gaithersburg
fYear
2007
fDate
19-22 March 2007
Firstpage
20
Lastpage
25
Abstract
Optical critical dimension (OCD) metrology has rapidly become an important technology in supporting the worldwide semiconductor industry. OCD relies on a combination of measurement and modeling to extract the average dimensions of an array of parallel features, having fixed pitch and drawn linwidth. This paper reports results of OCD measurements on arrays selected to serve as prototype reference structures. In addition, SEM CD measurements were made on several of these structures to verify line uniformity. These prototypes are fabricated using the single-crystal CD reference materials (SCCDRM) process, which in prior work has been successfully applied to isolated feature reference materials. The SCCDRM process provides features with known geometries, typically vertical sidewalls, defined by the silicon lattice.
Keywords
SIMOX; data acquisition; integrated circuit measurement; integrated circuit technology; integrated circuit testing; measurement by laser beam; scanning electron microscopy; spatial variables measurement; SEM CD measurements; SIMOX wafer; data acquisition; ellipsometry; laser measurement; optical critical dimension applications; scatterometry; semiconductor industry; single-crystal CD reference materials process; test structures fabrication; Electronic equipment testing; Gratings; Lattices; Materials testing; NIST; Optical materials; Optical scattering; Semiconductor device testing; Silicon; USA Councils; Critical Dimension (CD); Linewidth; Metrology; Optical Critical Dimension (OCD); Scatterometry;
fLanguage
English
Publisher
ieee
Conference_Titel
Microelectronic Test Structures, 2007. ICMTS '07. IEEE International Conference on
Conference_Location
Tokyo
Print_ISBN
1-4244-0781-8
Electronic_ISBN
1-4244-0781-8
Type
conf
DOI
10.1109/ICMTS.2007.374448
Filename
4252398
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