• DocumentCode
    2886957
  • Title

    Development of a measurement technique for highly conductive CVD diamonds and analysis of uncertanties due to 3D heat losses

  • Author

    Arik, Mehmet ; Li, Ri ; Andreini, Kristian ; Crosby, Jared ; Shaddock, Dave ; Kizil, Huseyin

  • Author_Institution
    Thermal Syst. Lab., Gen. Electr. Global Res. Center, Niskayuna, NY, USA
  • fYear
    2010
  • fDate
    2-5 June 2010
  • Firstpage
    1
  • Lastpage
    8
  • Abstract
    Thermal spreaders have been of interest over the last few decades. Heat pipes, Thermal Pyrolytic Graphite (TPG), and other graphite-based materials have been commonly used for enhancing the thermal performance. This study will start for a discussion of Chemical Vapor Deposition (CVD) of diamond manufacturing to enable high conductivity plates for heat spreading. Later attention will be turned to absolute thermal conductivity measurements. A measurement technique for the thermal conductivity of a thin diamond plate was proposed. Baseline measurements have been established via a similar copper plate with a thermal conductivity of 400 W/m-K. IR thermal images were collected. Heat losses are calculated via analytical and numerical models. We found that one type of thermal management CVD diamond has a thermal conductivity of approximately 820 W/m-K accounting both diamond film and thin Silicon substrate.
  • Keywords
    chemical vapour deposition; diamond; heat losses; thermal conductivity; thin films; C; CVD; IR thermal images; Si; baseline measurements; chemical vapor deposition; diamond manufacturing; graphite-based materials; heat losses; heat pipes; heat spreading; thermal conductivity; thermal pyrolytic graphite; thermal spreaders; thin diamond plate; thin silicon substrate; Chemical vapor deposition; Conducting materials; Conductive films; Conductivity measurement; Copper; Manufacturing; Measurement techniques; Numerical models; Thermal conductivity; Thermal management;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm), 2010 12th IEEE Intersociety Conference on
  • Conference_Location
    Las Vegas, NV
  • ISSN
    1087-9870
  • Print_ISBN
    978-1-4244-5342-9
  • Electronic_ISBN
    1087-9870
  • Type

    conf

  • DOI
    10.1109/ITHERM.2010.5501258
  • Filename
    5501258