Directions in smart power ICs

A new breed of VLSI is emerging: dies containing large power devices in combination with control circuitry. The smart power IC converts the small signal output of a system to drive a load, often conducting many amperes and standing off hundreds of volts in so doing. Present ICs involve such functions as protection, status or pulse width control and are constantly evolving towards expanding sophistication. The panel will explore the future of smart power in all of its aspects. The nature of the power device(s) and the extent of its intelligence will be assessed in light of new fabrication processes and consider MOS versus bipolar digital versus analog, monolithic versus multiple die solutions, standard versus custom and the challenge of packaging.