• DocumentCode
    2887326
  • Title

    Conformal CVD-ruthenium process for MIM capacitor in giga-bit DRAMs

  • Author

    Seok-Jun Won ; Wan-Don Kim ; Cha-Young Yoo ; Sung-Tae Kim ; Young-Wook Park ; Joo-Tae Moon ; Moon-Yong Lee

  • Author_Institution
    Process. Dev. Team, Samsung Electron. Co. Ltd., Kyungki, South Korea
  • fYear
    2000
  • fDate
    10-13 Dec. 2000
  • Firstpage
    789
  • Lastpage
    792
  • Abstract
    To realize the gigabit-scale DRAM capacitor, it is necessary to develop new electrode materials instead of poly-Si and TiN. Among them, Ruthenium has been the most promising electrode material in advance of Pt or Ir because it can be easily etched by oxygen plasma and shows good electrical properties as a capacitor electrode. But, a CVD-Ru film with good conformality and smooth morphology actually applicable to gigabit-scale DRAM generations has not been known up to now. In this work, we present the development of novel CVD process for application in real device with 3-dimensional structure and the electrical properties of capacitor using CVD-Ru electrode.
  • Keywords
    CVD coatings; DRAM chips; MIM devices; capacitors; conformal coatings; electrodes; ruthenium; MIM capacitor; Ru; conformal CVD ruthenium process; electrical properties; electrode material; gigabit DRAM; three-dimensional device; Electrodes; Etching; MIM capacitors; Morphology; Plasma applications; Plasma devices; Plasma materials processing; Plasma properties; Random access memory; Tin;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electron Devices Meeting, 2000. IEDM '00. Technical Digest. International
  • Conference_Location
    San Francisco, CA, USA
  • Print_ISBN
    0-7803-6438-4
  • Type

    conf

  • DOI
    10.1109/IEDM.2000.904436
  • Filename
    904436