DocumentCode :
2887331
Title :
Improved Test Structure for Thermnal Resistance Scaling Study in Power Devices
Author :
Canepari, Anna ; Bertrand, Guillaume ; Giry, Alexandre ; Minondo, Michel ; Ortolland, Sylvie ; Jaouen, Hervé ; Szelag, Bertrand ; Mourier, Jocelyne ; Chante, Jean-Pierre
Author_Institution :
STMicroelectron., Crolles
fYear :
2007
fDate :
19-22 March 2007
Firstpage :
222
Lastpage :
225
Abstract :
Power MOSFET´s suffer from a strong self-heating effect. This phenomenon is currently modeled with a thermal resistance Rth. Understanding the evolution of the Rth with device scaling is today an important issue. This paper presents an improved test structure for temperature measurements in multifinger LDMOS power devices. This structure allows to access the temperature of every device finger. With this approach, impact of boundary effects and thermal coupling on Rth can be investigated. Measurements results are presented and a basic distributed model is used to reproduce Rth behavior.
Keywords :
power MOSFET; semiconductor device testing; thermal resistance measurement; boundary effects; multifinger LDMOS power devices; power MOSFET; self-heating effect; temperature measurement; thermal coupling; thermal resistance scaling study; Automatic testing; Desktop publishing; Electric resistance; Electrical resistance measurement; Fingers; Measurement standards; Microelectronics; Temperature measurement; Temperature sensors; Thermal resistance; Rth extraction; gate resistance measurements; scaling; self-heating;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Microelectronic Test Structures, 2007. ICMTS '07. IEEE International Conference on
Conference_Location :
Tokyo
Print_ISBN :
1-4244-0781-8
Electronic_ISBN :
1-4244-0781-8
Type :
conf
DOI :
10.1109/ICMTS.2007.374488
Filename :
4252438
Link To Document :
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