Reliability assessment of a 28 V DC power module

Author

Jha, Vibhash ; McCluskey, F.P.

Author_Institution

Univ. of Maryland, College Park, MD, USA

fYear

2010

fDate

2-5 June 2010

Firstpage

1

Lastpage

6

Abstract

This paper investigates the effort to improve the reliability of a power module using physics-of-failure based approach. Thermal simulation of the power module board with the heat sink has been carried out and further these results have been used for estimating the overall thermal cycle reliability. Solder joint reliability has been investigated using two different kinds of solders -SAC and Eutectic solder. It is seen that inductor components are failing early due to the delamination of the adhesive between ferrite surfaces. An experimental study is done to evaluate different kind of epoxy adhesives and to choose a suitable one.

Keywords

adhesives; heat sinks; modules; reliability; solders; thermal analysis; Eutectic solder; epoxy adhesives; ferrite surfaces; heat sink; physics-of-failure based approach; power module board; reliability assessment; solder joint reliability; thermal cycle reliability estimation; thermal simulation; voltage 28 V; Heat sinks; Inductors; Multichip modules; Power dissipation; Power system reliability; Schottky diodes; Soldering; Temperature; Thermal management of electronics; Thermal resistance;

fLanguage

English

Publisher

ieee

Conference_Titel

Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm), 2010 12th IEEE Intersociety Conference on

Conference_Location

Las Vegas, NV

ISSN

1087-9870

Print_ISBN

978-1-4244-5342-9

Electronic_ISBN

1087-9870

Type

conf

DOI

10.1109/ITHERM.2010.5501280

Filename

5501280