• DocumentCode
    2887684
  • Title

    Adhesion of encapsulating films used in PV module manufacturing

  • Author

    Santoso, Ricky ; Kenney, Maryann

  • Author_Institution
    St. Gobain Performance Plastic, Northborough, MA, USA
  • fYear
    2010
  • fDate
    2-5 June 2010
  • Firstpage
    1
  • Lastpage
    4
  • Abstract
    In this study, several surface treatment methods (Corona, Atmospheric Plasma and Saint-Gobain´s proprietary treatment) were explored to understand the effectiveness of each method in creating an ETFE surface more favorable for bonding to Solarbond™ EVA. Surface analyses indicate that all surface treatment technologies evaluated incorporate polar oxygen and nitrogen containing functionalities onto the ETFE surface. However, our study shows that the presence of such polar functionalities on the ETFE surface is not the only factor that is critical to ensure good adhesion strength to Solarbond™ EVA. The existence of a mechanically weak boundary layer on the treated ETFE surface appears to play an equally important role in affecting the adhesion strength to Solarbond™ EVA. We propose that the higher adhesion strength of Solarbond™ EVA to Fluorosol™ ETFE treated with Saint Gobain´s (SG) proprietary treatment can be attributed to the presence of appropriate polar functionalities as well as the mechanically-strong boundary layer created as a result of treatment.
  • Keywords
    adhesion; bonding processes; photovoltaic cells; surface treatment; ETFE surface; Fluorosol ETFE; PV module manufacturing; Saint-Gobain´s proprietary treatment; Solarbond EVA; adhesion; atmospheric plasma; bonding; corona; encapsulating films; mechanically weak boundary layer; nitrogen containing functionalities; polar oxygen; surface analysis; surface treatment; Adhesives; Bonding; Corona; Degradation; Manufacturing; Photovoltaic systems; Protection; Solar power generation; Surface contamination; Surface treatment; Adhesion; ETFE; EVA; Encapsulant; Fluoropolymer; Fluorosol™; Photovoltaic modules; Solarbond™; Surface treatment;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm), 2010 12th IEEE Intersociety Conference on
  • Conference_Location
    Las Vegas, NV
  • ISSN
    1087-9870
  • Print_ISBN
    978-1-4244-5342-9
  • Electronic_ISBN
    1087-9870
  • Type

    conf

  • DOI
    10.1109/ITHERM.2010.5501294
  • Filename
    5501294