Thermal cycling fatigue analysis of SAC387 solder joints

Author

Williams, Chandra ; Tan, Kok Ee ; Pang, John H L

Author_Institution

Sch. of Mech. & Aerosp. Eng., Nanyang Technol. Univ., Singapore, Singapore

fYear

2010

fDate

2-5 June 2010

Firstpage

1

Lastpage

7

Abstract

In this study, finite element analysis (FEA) was used to simulate a thermal cycling test result for a PBGA assembly with Sn-3.8Ag-0.7Cu solder joints subject to thermal cycling of -40°C to +125°C. The PBGA assembly was modeled using a 3D-quarter 1/8th octant model of the PBGA assembly. Two constitutive models for the SAC387 solder were investigated using the Anand Viscoplastic (AV) model and elastic-plastic-creep (EPC) model. Low cycle fatigue life prediction based on non-linear Plastic work (PLWK) and inelastic strain energy density (SED) were used to predict the thermal cycling fatigue life and compared to the test results. Volume averaging studies are needed to quantify the effect of the volume of elements selected on the non-linear Plastic work (PLWK) and inelastic strain energy density (SED), and fatigue life results

Keywords

ball grid arrays; elastoplasticity; fatigue testing; finite element analysis; life testing; solders; thermal analysis; viscoplasticity; 3D-quarter 1/8th octant model; PBGA assembly; SAC387 solder joints; anand viscoplastic model; elastic-plastic-creep model; finite element analysis; inelastic strain energy density; low cycle fatigue life prediction; nonlinear plastic work; thermal cycling fatigue analysis; thermal cycling test; Assembly; Capacitive sensors; Electronic packaging thermal management; Fatigue; Material properties; Materials testing; Plastics; Soldering; Solid modeling; Temperature dependence; Anand Model; Elastic Plastic Creep; Lead Free; Low cycle fatigue; PBGA; Solder joint fatigue; Strain Energy Density; Thermal Cycling;

fLanguage

English

Publisher

ieee

Conference_Titel

Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm), 2010 12th IEEE Intersociety Conference on

Conference_Location

Las Vegas, NV

ISSN

1087-9870

Print_ISBN

978-1-4244-5342-9

Electronic_ISBN

1087-9870

Type

conf

DOI

10.1109/ITHERM.2010.5501296

Filename

5501296