DocumentCode
2888030
Title
Processor caches built using multi-level spin-transfer torque RAM cells
Author
Yiran Chen ; Weng-Fai Wong ; Hai Li ; Cheng-Kok Koh
Author_Institution
Electr. & Comput. Eng. Dept., Univ. of Pittsburgh, Pittsburgh, PA, USA
fYear
2011
fDate
1-3 Aug. 2011
Firstpage
73
Lastpage
78
Abstract
It has been predicted that a processor´s caches could occupy as much as 90% of chip area for technology nodes from the current. In this paper, we study the use of multi-level spin-transfer torque RAM (STT-RAM) cells in the design of processor caches. Compared to the traditional SRAM caches, a multi-level cell (MLC) STT-RAM cache design is denser, fast, and consumes less energy. However, a number of critical issues remains to be solved before MLC STT-RAM technology can be deployed in processor caches. In this paper, we shall offer solutions to the issue of bit encoding as well as tackle the write endurance problem. The latter has been neglected in previous works on STT-RAM caches. We propose a set remapping scheme that can potentially prolong the lifetime of a MLC STT-RAM cache by 80× on average. Furthermore, a method for recovering the performance that may be lost in some applications due to set remapping is introduced.
Keywords
cache storage; random-access storage; MLC STT-RAM cache; SRAM caches; bit encoding; multilevel spin-transfer torque RAM cells; processor caches; Benchmark testing; Encoding; Magnetic tunneling; Magnetization; Random access memory; Resistance; Switches; MLC; STT-RAM; spintronic;
fLanguage
English
Publisher
ieee
Conference_Titel
Low Power Electronics and Design (ISLPED) 2011 International Symposium on
Conference_Location
Fukuoka
ISSN
Pending
Print_ISBN
978-1-61284-658-3
Electronic_ISBN
Pending
Type
conf
DOI
10.1109/ISLPED.2011.5993610
Filename
5993610
Link To Document