Title :
On VLSI interconnects
Author_Institution :
Dept. of Electr. Eng., Columbia Univ., New York, NY, USA
Abstract :
The author reviews some recent approaches to the computation of transient response of VLSI circuits interconnected by transmission lines and discontinuities such as angled-bends. These approaches are based on modeling of the interconnects as subcircuits consisting of ordinary lumped elements, controlled sources and sections of ideal transmission lines (delay elements). In this way, the transient solution of the entire circuit can be obtained from a SPICE-like simulator, and FFT, discrete convolution or inversion of the Laplace transform can all be avoided. Examples of models of lossy transmission lines and 90° bends are given
Keywords :
VLSI; circuit analysis computing; semiconductor device models; time-domain analysis; transient response; transmission line theory; RLGC line; SPICE-like simulator; VLSI interconnects; angled-bends; controlled sources; delay elements; discontinuities; lumped elements; modeling; subcircuits; transient response; transmission lines; Circuit simulation; Convolution; Delay lines; Distributed parameter circuits; Integrated circuit interconnections; Laplace equations; Power system transients; Transient response; Transmission line discontinuities; Very large scale integration;
Conference_Titel :
Circuits and Systems, 1991. Conference Proceedings, China., 1991 International Conference on
Conference_Location :
Shenzhen
DOI :
10.1109/CICCAS.1991.184532
